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Ultra-high thermal conductivity diamond features high mechanical strength, excellent insulation, low dielectric constant, and light weight. Its room-temperature thermal conductivity is more than five times that of copper, enabling semiconductor devices to achieve higher power density and improved reliability in smaller spaces. It serves as a **thermal management material** for heat dissipation in high-heat-flux devices.
Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd.
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