Post Demand

Silicon Oxide, Silicon Oxide Powder, Nano Silicon Oxide

price  Grid 
¥0.00
Hefei Zhonghang Nanotechnology Development Co., Ltd.
Shop owner:Manager Deng
Address:Gangji Industrial Park
热Sell商品
  • Product Introduction

Product Parameters

Product

Silicon oxide powder

Product Model

ZH-SiO2-A

Average particle size

1-3um

Product Purity

99.8%

Specific surface area

2.35m2/g

Melt Dot

1650℃

Boiling Point.

2230℃

Crystal type

Sphere

Outside View

White powder

Dispersion

Preparation by Laser Flame Spray Melting Method, easy to disperse liquids and polymer materials

Note: Product specifications, particle size, and surface activity treatment can be arranged for production according to customer requirements.

Product Features
Spherical silica powder is prepared using the laser flame jet melting method. The resulting product features high purity, uniform particle size distribution, a clean surface, high sphericity, high whiteness, no residual impurities, easy dispersibility, and excellent compatibility with organic materials. As a filler for epoxy resin encapsulation materials, it not only exhibits strong fluidity and high insulation properties but also possesses stable chemical characteristics. It effectively enhances product performance, helps reduce stress, improves material flexibility, and lowers mold wear rates.
Advantages Application
1. High sphericity and uniform particle size allow for maximum addition without significant changes in the viscosity of the polymer system.
2. Spherical silica has good surface fluidity, allowing it to mix evenly with resin to form a uniform film. It requires a small amount of resin, exhibits excellent fluidity, and allows for a high filling rate of the powder. The smaller the thermal expansion coefficient and the lower the thermal conductivity, the closer it gets to the thermal expansion coefficient of single-crystal silicon. Consequently, the performance of electronic components produced in this way is improved.
3. When spherical silica is used to fill plastic-encapsulated integrated circuit chips, the yield rate is high. Spherical silica powder has a low friction coefficient, resulting in minimal wear on the mold and extending its service life. Compared to angular powder, it can double the mold's lifespan.
4. It is mainly used for large-scale integrated circuit packaging, and also finds applications in high-tech fields such as aviation, aerospace, fine chemicals, rewritable optical discs, large-area electronic substrates, special ceramics, and daily cosmetics.
Packaging and Storage:
1. This product is packaged in nylon bags and should be stored sealed in a dry, cool environment. It should not be exposed to air to prevent moisture absorption, which may cause oxidative agglomeration and affect dispersion performance and usage effectiveness.
2. If the product accidentally gets into the eyes during use, rinse immediately with fresh water. Seek medical treatment if the condition is severe.
3. The packaging quantity can be provided according to customer requirements, with sub-packaging available.


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