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Gas-atomized pure copper powder:
Performance Features: High powder purity, spherical particle shape, good compressibility, and high electrical and thermal conductivity.
Application fields: electronics, spraying, 3D printing, construction, transportation, aerospace, national defense, and other areas, such as circuit board manufacturing, radio frequency shielding, solder mask materials, and aircraft engine blades.
Grade | Chemical composition | Bulk density g/ml | Particle Size Distribution % | |||
| Copper content ≥% | Oxygen content ≤% | ≥200Eye | ≥325Eye | ＜325Eye | ||
Cu-01 | 99.95 | 0.04 | 5.1-5.6 | 1-8 | 20-30 | 60-70 |
Cu-02 | 99.9 | 0.04 | 5.0-5.6 | 1-8 | 20-30 | 60-70 |
Performance Features: High powder purity, spherical particle shape, good compressibility, and high electrical and thermoelectric conductivity.
Application areas: electronics, spraying, 3D printing, construction, transportation, aerospace, national defense, and other fields, such as circuit board manufacturing, radio frequency shielding, solder mask materials, and aircraft engine blades.
