Vacuum Atomized Pure Copper Powder

Performance Features: High surface activity and excellent electrical and thermal conductivity; high sphericity, superior flowability, good powder spreading effect, and high-quality printing and forming; uniform particle size distribution, high tap density, and high density of printed parts; low oxygen content, which is more conducive to improving the dimensional accuracy and surface quality of formed parts.

Application Fields: Powder metallurgy, electronic materials, heat dissipation, printing, metal coatings, and other areas.