Properties of Conductive Ceramics

The formation, microstructure, and electrical properties of conductive ceramics have been studied. Methylpolysiloxane andTiH2Granules are mixed as filler, and1600Celsius1hour850Pyrolysis is carried out at the temperature after preheating treatment in a nitrogen atmosphere, under atmospheres of nitrogen, argon, and vacuum. Depending on the different atmospheric conditions,TiN和Ti5Si3The appearance is determined byTiH2Particles serve as reactive fillers and react with atmospheric gases or pyrolysis products such asSiO2Formed by reaction. Therefore, ceramic composite materials70Microstructure of the roll. %TiH2Particle pyrolysis in1600Vacuum at degrees Celsius1An hour is composed ofTiNand particlesTi5Si3Yes. The density and electrical conductivity of this ceramic composite material are97.3％，TDand respectively. These composite materials are considered to be derived from polymer pyrolysis.103〜104A conductive material with excellent values on a logarithmic scale at room temperature.。

Application
Several practical applications with confirmed potential have been identified. Due to the development of composite materials with electrical conductivity, fire resistance, and high wear and impact resistance, they can serve as anodes, heating elements, sensors, and circuit breakers, as well as in related applications requiring high current or high-temperature conditions. They can also be used for the simultaneous bonding of silicon carbide industrial components through direct electrical heating, enabling both the heating element and adhesive donor to function together.

In addition to the applications mentioned above, composite materials have been evaluated as cathodes and anodes. Polarization measurements indicate the formation of interfacial oxides on the surface. When they are considered as anodes, passivation occurs. However, after coating with a thin layer of platinum, the anodic behavior of the composite material approaches that of pure, solid platinum.PtAnodic. Therefore, these materials can be used as a base for applications in oxygen release or fluorine contamination generated by copper fluoride electroplating.