The Puhler Series Nano Pin-Type Bead Mill is a horizontal bead mill with large-flow circulation developed by PUHLER Company. It is a new type of nano-grinding equipment that meets the fineness requirements of various topcoats and nano products, with a narrow particle size distribution. The PHN adopts a **gap separator system** with an ultra-large filtration area, meeting the requirements for large-flow multiple grinding needed in the production of various high-grade topcoats. The flow rate of the PHN is several times that of traditional bead mills. The separator is wear-resistant, has a long service life, and can use extremely small grinding media without clogging the discharge filter.

Through strategic collaborative experiments with universities such as the Department of Building Materials at South China University of Technology and the Department of Fine Chemical Engineering at Shenzhen Polytechnic, breakthroughs have been made in addressing the fineness issues of products such as inkjet inks, alumina, and pharmaceuticals. According to third-party testing reports, the final product fineness can reach the nanoscale (<100nm) or below.
Suitable for grinding materials that are extremely difficult to disperse, it can achieve thorough dispersion after multiple grinding cycles.
Multiple cooling measures are adopted, ensuring excellent heat dissipation performance, making it suitable for grinding temperature-sensitive materials.
The product quality exhibits good reproducibility, with uniform particle size distribution, and is not affected by the circulation flow rate.

PUHLERBrand New Radial Grinding MachineYes.Globally renowned grinding systemFurther research and development have been carried out.; and obtained approval from the **Bureau., fully enclosed, short/Coarse grinding chamber design elements,3:9The length of the golden ratio/Diameter/The linear velocity coefficient ratio is more optimal, enabling high-energy-density energy input and **reasonably combining** them to provide you with a more economical solution.Wet grinding technology；

New Type Radial Grinding MachineFor grinding large quantities of materials, it is the most economical choice. Compared to other grinding equipment, both the equipment investment and the cost of selecting grinding media are lower. Additionally, the advantages of this model include achieving a finer and narrower particle size distribution than other types, the ability to continuously process large volumes of slurry, and the option to add material components to the pre-mixing tank at any time during the grinding process. Moreover, since the slurry passes through the grinding chamber in just 15-25 seconds, precise temperature control can be achieved.
• By adopting an efficient separation system, the safe separation of grinding beads is ensured even under very high flow rates. The large-sized cylindrical centrifugal separator screen minimizes flow resistance (i.e., pressure drop).
For the cosmetics, pharmaceutical, food, and biochemical engineering industries, PUHLER can provide mills made entirely of stainless steel, along with special equipment to meet the specific needs of customers. Below are some examples of how to address the unique requirements of individual clients:
• The rack is made of stainless steel and polished with 160-grit abrasive.
• The mechanical seal fluid is prepared using a solvent.
• The cleaning solution container, cooling coil, and pipe fittings are all made of stainless steel.
• The material of the wear parts in contact with the product is zirconium oxide.
• The turbine is made of zirconia material.
• The product's inlet and outlet are connected using quick-clamping devices.
• The cooling circuit is capable of adapting to cooling/heating media ranging from -15°C to 110°C.
• Probe thermometer (PT 100) and pressure gauge
• Water-cooled main motor

Püller's new radial grinding machineMainly used for ultra-fine grinding and dispersion of materials requiring "zero pollution" and high viscosity, high hardness.
1) Color paste / Color filter / TFT LCD: R, G, B, Y, and BM have been successfully dispersed and ground to the nanoscale, with transparency exceeding 90%, viscosity controlled at 5-15 CPS, and moisture content below 1%.
2) Ink-jet Inks: Pigment-based ink-jet inks have been successfully dispersed and ground to the nanoscale, with viscosity controlled below 5 CPS.
3) CMP (Chemical Mechanical Polish) slurry: The particle size of the polishing slurry required for semiconductor wafer grinding has reached