Post Demand

Semiconductor Wafer Grinding and Polishing Materials

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0.00
广东奔朗新材料股份有限公司
店主:邓经理
地址:佛山市顺德区陈村镇广隆工业园兴业八路7号
  • 产品介绍
Grinding fluids, emulsifiers (oil-based/water-based) grinding fluids, and polishing fluids (cerium oxide CeO₂, green silicon carbide GC, diamond powder) (diamond slurry, aluminum oxide Al₂O₃ slurry, silicon oxide SiO₂ slurry) are primarily used for precision grinding and polishing of material surfaces such as optical glass, sapphire, silicon wafers, and silicon carbide wafers.


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