The Puhler Series Nano Pin-Type Rod Mill is a high-flow circulation horizontal bead mill developed by PUHLER. As a new type of nano-grinding equipment, it meets the fineness requirements of various topcoats and nano products, making it suitable for continuous dispersion and wet grinding of micron and nano-scale materials ranging from low to high viscosity. The product features a narrow particle size distribution. The PHN adopts a **gap separator system** with an ultra-large filtration area, meeting the high-flow, multi-pass grinding requirements for producing various high-grade topcoats. The flow rate of the PHN is several times that of traditional bead mills. The separator is wear-resistant and has a long service life. It can use extremely small grinding media (0.1 mm) without clogging the discharge filter.

The Pühler new radial grinding mill is a novel grinding machine where the slurry flow direction aligns with the rotor's centrifugal direction. It is a horizontal high-efficiency grinding mill that uses small balls of only 0.05–0.8 mm as the grinding medium, capable of grinding materials to 300–600 nanometers in a short time, with a narrow and concentrated particle size distribution, making it a global **first**! **.**

Here is the English translation of the Chinese content summary: **Content Summary**

PUHLER Brand New Radial Grinding MachineYes.Globally renowned grinding systemFurther research and development have been carried out.; and obtained approval from the **Bureau.Fully enclosed, short/Coarse grinding chamber design elements,3:9The length of the golden ratio/Diameter/The linear velocity coefficient ratio is more favorable, enabling high-energy-density energy input and its **rational combination to provide you with a more economical** solution.Wet grinding technology；

New Type Radial Grinding MachineFor grinding large quantities of materials, it is the most economical choice. Compared to other grinding equipment, both the equipment investment and the cost of selecting grinding media are lower. Additionally, the advantage of this model is that it can achieve a finer and narrower particle size distribution than other models, enabling continuous processing of large volumes of slurry. It also allows for the addition of material components to the pre-mixing tank at any time during the grinding process. Moreover, since the slurry passes through the grinding chamber in just 15-25 seconds, precise temperature control can be achieved.
• By adopting an efficient separation system, the safe separation of grinding beads is ensured even under very high flow rates. The large-sized cylindrical centrifugal separator screen minimizes flow resistance (i.e., pressure drop).
For the cosmetics, pharmaceutical, food, and biochemical engineering industries, PUHLER can provide mills made entirely of stainless steel, along with special equipment to meet the specific needs of customers. Below are some examples illustrating how to address the unique requirements of individual clients:
• The rack is made of stainless steel and polished with 160-grit abrasive.
• The mechanical seal fluid is prepared using a solvent.
• The cleaning solution container, cooling coil, and pipe connectors are all made of stainless steel.
• The material of the wear parts in contact with the product is zirconium oxide.
• The turbine is made of zirconia material.
• The product uses quick-clamping devices for both import and export connections.
• The cooling circuit is capable of adapting to cooling/heating media ranging from -15°C to 110°C.
• Probe thermometer (PT 100) and pressure gauge
• Water-cooled main motor

Püller's new radial grinding machineMainly used for ultra-fine grinding and dispersion of materials requiring "zero pollution" and high viscosity, high hardness.
1) Color paste / Color filter / TFT LCD: R, G, B, Y, and BM have been successfully dispersed and ground to the nanoscale, with transparency exceeding 90%, viscosity controlled at 5-15 CPS, and moisture content below 1%.
2) Ink-jet Inks: Pigment-based ink-jet inks have been successfully dispersed and ground to the nanoscale, with viscosity controlled below 5 CPS.
3) CMP (Chemical Mechanical Polish) slurry: The particle size of the polishing slurry required for semiconductor wafer polishing has reached