Post Demand

Mechanical exfoliation of tungsten diselenide on silicon oxide/silicon substrate

price  Grid 
¥0.00
Brand:
先丰纳米
Model:
101050
Mesh count:
10 mmx10 mm
Grade:
Level 1
Jiangsu Xianfeng Nanomaterials Technology Co., Ltd.
Shop owner:Manager Deng
Address:Building 9, Phase I, Zifeng Yanchuang Center, No. 29 Buyue Road, Nanjing, Jiangsu Province
You May Like
Mechanical seal
¥5.00¥0.00
热Sell商品
  • Product Introduction
Item Number CAS number Number Packaging Parameter
101050 7440-33-7 XFG23 1 box Base size: 10 mm x 10 mm

Product Name

Chinese Name: Mechanical exfoliation of tungsten diselenide on silicon dioxide/silicon dioxide substrate

I'd be happy to help translate Chinese to English while preserving HTML tags, numbers, and technical terms. However, I don't see any Chinese text in your message. Could you please provide the Chinese text you'd like me to translate?Mechanical exfoliation WSe2 on SiO2/Si

Nature

Morphology: Thin film

Parameter

Substrate: Silicon Oxide/Silicon

Base size: 10 mm x 10 mm

Oxide layer: 300nm

WSe2Area: >10 μm2



Application

Xianfeng Nano** has introduced tungsten diselenide prepared by mechanical exfoliation. This material features fewer defects and excellent optical properties, enabling the study of layer number and fluorescence effects. Additionally, as it retains the original lattice structure, it is an ideal material for device fabrication.


Compare栏Close